4.5mJ High Pulse Energy Picosecond Lasers for Advanced Glass & Brittle Material Cutting

Introducing the AOPico Montauk 1064 90W-20k Platform

Breaking Through the Limits of Brittle Material Processing

As glass, sapphire, ceramics, and other brittle materials become increasingly important in consumer electronics, photonics, semiconductors, and advanced manufacturing, manufacturers face growing demands for:

• Higher edge quality
• Lower chipping and micro-cracking
• Increased throughput
• Greater processing thickness capability

Traditional cutting technologies — including mechanical scribing, CO₂ lasers, and lower pulse-energy ultrafast lasers — often struggle to simultaneously achieve high edge strength, thick material capability, and industrial throughput.

To address these challenges, Advanced Optowave introduces the AOPico Montauk 1064 90W-20k, a new generation high-power, high pulse energy picosecond laser platform designed specifically for demanding brittle material processing applications.

A New Level of Picosecond Processing Power

The new AOPico Montauk 1064 delivers:

• ≥90W average power
• >4,500 μJ pulse energy
• 20 kHz operation
• <15 ps pulse width
• Excellent beam quality (M² <1.5)

This unique combination of high pulse energy + ultrashort pulse duration enables significantly deeper and more efficient energy deposition compared with conventional picosecond systems that rely primarily on high repetition rates.

The result is:
✔ Faster processing
✔ Reduced pass counts
✔ Improved internal modification quality
✔ Better edge strength after separation
✔ Capability for thicker brittle materials

Why High Pulse Energy Matters in Glass Cutting

Deeper Internal Modification

For stealth dicing and internal modification processes, pulse energy is one of the most critical parameters.

With pulse energies exceeding 4.5 mJ, the AOPico Montauk 1064 enables:

• Larger and more uniform modification zones
• More stable crack propagation
• Better separation consistency across thick materials

This becomes particularly important when processing:

• Thick aluminosilicate glass
• Sapphire
• Quartz / fused silica
• Technical ceramics
• Optical glass substrates

Processing Thickness Beyond Conventional Limits

Conventional ultrafast laser systems are often optimized for thin materials. However, high pulse energy significantly expands the achievable processing depth.

The AOPico Montauk platform is designed for:

• Thin precision glass cutting
• Thick brittle material separation
• Multi-layer glass structures
• Sapphire and optical substrate processing

Depending on material properties and process methods, cutting thicknesses can reach:

• Up to 15 mm and beyond for selected glass and brittle materials

This opens opportunities for:

• Advanced optics manufacturing
• Semiconductor packaging
• Automotive glass processing
• Industrial glass fabrication
• High-end photonics components

Stealth Dicing and Internal Modification Advantages

Minimal Surface Damage

The ultrashort pulse duration confines thermal effects within the interaction zone, producing:

• Extremely low heat-affected zone (HAZ)
• Reduced chipping
• Minimal micro-cracking
• Smooth separation surfaces

Improved Edge Strength

Compared with conventional thermal cutting methods, picosecond internal modification preserves higher mechanical strength along the cut edge.

Benefits include:

• Reduced downstream breakage
• Higher reliability
• Improved production yield

Higher Throughput

Higher pulse energy allows:

• Faster scan speeds
• Fewer process passes
• Improved overall productivity

This is especially important for industrial automation environments requiring high throughput and stable operation.

Engineered for Industrial Integration

The AOPico Montauk 1064 is designed for real-world production systems:

• Stable pulse-to-pulse energy performance
• Excellent long-term power stability
• Compact industrial architecture
• Integration-ready communication and control interfaces
• Compatible with galvo scanners, motion stages, and automated systems

The laser platform supports both:

• Precision direct ablation
• Internal modification / stealth cutting processes

Applications

Glass Cutting

• Cover glass
• Display glass
• Chemically strengthened glass
• Optical glass
• Thick industrial glass

Sapphire Processing

• Camera cover glass
• Optical windows
• Semiconductor substrates
• LED materials

Advanced Brittle Materials

• Quartz / fused silica
• Technical ceramics
• Transparent substrates
• Multi-layer optical structures

Why Choose Advanced Optowave?

Advanced Optowave combines:

• High-performance ultrafast laser design
• Strong application engineering support
• Industrial integration experience
• Sample testing and process development capabilities